Type

CPU / Microprocessor

Market segment

Desktop

Family

Model number ? 

CPU part numbers

• CM8067702868535is an OEM/tray microprocessor

• BX80677I77700Kis a boxed processor without fan and heatsink (English version)

• BXC80677I77700Kis a boxed processor without fan and heatsink (Chinese version)

Frequency ? 

4200 MHz

Maximum turbo frequency

4500 MHz

Bus speed ? 

8 GT/s DMI

Clock multiplier ? 

42

Package

1151-land Flip-Chip Land Grid Array

Socket

Socket 1151 / H4 / LGA1151

Size

1.48" x 1.48" / 3.75cm x 3.75cm

Introduction date

January 3, 2017

Price at introduction

$339 (OEM)
$350 (box)

Microarchitecture

Kaby Lake

Processor core ? 

Kaby Lake-S

Core stepping ? 

B0 (SR33A)

Manufacturing process

0.014 micron

Data width

64 bit

The number of CPU cores

4

The number of threads

8

Floating Point Unit

Integrated

Level 1 cache size ? 

4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches

Level 2 cache size ? 

4 x 256 KB 4-way set associative caches

Level 3 cache size

8 MB 16-way set associative shared cache

Physical memory

64 GB

Multiprocessing

Uniprocessor

Extensions and Technologies

• MMX instructions

• SSE / Streaming SIMD Extensions

• SSE2 / Streaming SIMD Extensions 2

• SSE3 / Streaming SIMD Extensions 3

• SSSE3 / Supplemental Streaming SIMD Extensions 3

• SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ? 

• AES / Advanced Encryption Standard instructions

• AVX / Advanced Vector Extensions

• AVX2 / Advanced Vector Extensions 2.0

• BMI / BMI1 + BMI2 / Bit Manipulation instructions

• F16C / 16-bit Floating-Point conversion instructions

• FMA3 / 3-operand Fused Multiply-Add instructions

• EM64T / Extended Memory 64 technology / Intel 64 ? 

• NX / XD / Execute disable bit ? 

• HT / Hyper-Threading technology ? 

• VT-x / Virtualization technology ? 

• VT-d / Virtualization for directed I/O

• TBT 2.0 / Turbo Boost technology 2.0 ? 

• TSX / Transactional Synchronization Extensions

• MPX / Memory Protection Extensions

• SGX / Software Guard Extensions

• SMAP / Supervisor Mode Access Prevention

• SMEP / Secure Mode Execution Protection

Low power features

• Core C1/C1E, C3, C6, C7 and C8 states

• Package C2, C3, C6, C7 and C8 states

• Enhanced SpeedStep technology ? 

Display controller

• 3 displays

• DisplayPort 1.2 / Embedded DisplayPort 1.4 / HDMI 1.4

Integrated graphics

GPU Type: Intel HD 630
Microarchitecture: Gen 9 LP
Base frequency (MHz): 350
Maximum frequency (MHz): 1150

Memory controller

The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, DDR4-2133, DDR4-2400
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 38.4

Other peripherals

• Direct Media Interface 3.0 (4 lanes)

• PCI Express 3.0 interface (16 lanes)

Maximum operating temperature ? 

100°C

Thermal Design Power ? 

91 Watt